Development of new electrical and optical
micro systems
for optical communication
for sensor applications
for medical products
FEM-simulation,
e.g. thermal modeling for power management,
mechanical stress analysis,
electro-optical RF-field analysis,
and other multi-physics stresses
Optimization of a structure,
for example in order to control temperature
and reduce mechanical tensions
Introduction of new packaging and assembly
technologies to volume production processes
Introduction of wafer based production processes
for hybrid micro-assembly
